SOMATECT KZ Series
SOMATECT KZ Series are heat curable resins for semiconductor sealing. Various resins for different applications such as glob-top resins, underfill resins and CSP reinforcing resins, etc. are available.
Features
- Easy-to-use one-part resins, and excellent in storage stability.
- Glob-top Resins
Various grades are available suited for each application adjusting to flow property and substrates, etc. - Underfill Resins
Excellent in properties of capillary flow and moisture resistance. - CSP Reinforcing Resins
Excellent for low temperature cure (at 80°C) as well as in repairability (KZ-107-4).
High reliability types used for automobile PCBs are also available.
Product Line-Up and Properties
- Glob-top Resins KZ-300 Series
- Underfill Materials KZ-200 Series
- Underfill Materials for BGA/CSP
| Application | Properties | Product Name |
Curing Conditions |
Viscosity | Tg Temp. |
Linear Expansion Coefficient | Shelf Life (Month/°C) |
|---|---|---|---|---|---|---|---|
| Glob-top | Low Flow/ Low Linear Expansion |
KZ-301 | 100°C /90min + 150°C /90min |
84Pa·s | 150°C | 2.0 × 10-5°C-1 |
6/≤-10 |
| Medium Flow/ Storage Stability |
KZ-310 | 100°C /60min + 150°C /150min |
77Pa·s | 150°C | 2.3 × 10-5°C-1 |
6/0 | |
| Underfill | Capillary Flow Type/High Adhesion |
KZ-210 | 150°C /60min |
40Pa·s | 135°C | 3.9 × 10-5°C-1 |
3/≤-20 |
| BGA Reinforcing |
Low Temp Cure/ Moisture Resistance |
KZ-106 | 85°C /60min or 100°C /30min |
9Pa·s | 90°C | 4.5 × 10-5°C-1 |
6/5-10 |
| Low Temp Cure/ Repairability |
KZ-107 | 80°C /45min or 120°C /5min |
3Pa·s | 55°C | 6.0 × 10-5°C-1 |
( All the figures are representative values. )
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